Ingot Squaring Equipment
Cuts multi-crystalline ingots into bricks using diamond wire technology
The centrotherm SiTec multi-crystalline ingot squaring saw is key equipment for integrated ingot and wafer facilities. The squaring equipment cuts multi-crystalline ingots [Gen5, Gen6 optional] into bricks using high speed diamond wire technology and cooling water only.
The ingot squaring equipment is available in two versions: basic version and advanced version. The basic version consists of one cutting unit. The advanced version consists of two cutting units, buffer and handling system for fully automatic loading, transfer and unloading. No manual handling or gluing of ingot is necessary. A cooling water recycling unit can also be connected to cropping and grinding equipment.
The fully automatic process consists of the following steps:
- Loading of ingot into first diamond wire cutting unit
- Cutting of ingot into slabs
- Automatic unloading and transfer of slabs to buffer and then to second diamond wire cutting unit
- Cutting of slabs into bricks
- Automatic transfer of bricks to brick line conveyor
Advantages
- Fully automatic cutting and handling process
- High cutting speed from 10 to 15 mm/min
- High throughput from 5,7 to 12,5 bricks per hour at 270 mm ingot height
- Reduced overhead time
- Automatic clamping, no gluing necessary
- Modular expandable system
- Designed to handle Gen5 and Gen6 ingots up to 1,000 kg
- Cooling water recycling unit optional
Note: centrotherm photovoltaics AG reserves the right to make changes in the product specifications at any time and without notice.
