Production Equipment

High-Pressure Vacuum Soldering System for Advanced Packaging

High-Pressure Vacuum Soldering System for Advanced Packaging

    Processes

    - Power Semiconductors
    - Advanced Packaging
    - Hybrid Microelectronic Assemblies
    - Optoelectronic Packaging
    - Hermetic Package Sealing
    - Wafer Level Packaging
    - UHB LED Packaging
    - MEMS Package Sealing

High Pressure Vacuum Soldering Furnace c.VLO 40 HP