c.VLO 180 | c.VLO 300
Vacuum Soldering Systems for High Volume Production
The centrotherm c.VLO 180 and c.VLO 300 vacuum soldering systems are ideally suited for high volume production facilities with various materials at up to 650°C.
The integrated heating and cooling plates can be individually controlled. With c.VLO 180 and c.VLO 300, the soldered area affected by voids can be reduced to less than 2% while typical reflow soldering systems range at 20%.
The system is ideally suited for production facilities which run fluxless and voidless soldering processes with various gas atmospheres (N2, H2 100, N2/H2 95/5). Wet chemical activation with HCOOH or dry chemical activation with MW plasma for ultra clean soldering joints are optionally available. Even lead free paste or pre-forms can be used without additional flux.
The process control computer comes with a user-friendly touch screen for operating, process profile editing and recipe storing. A serial interface allows to transfer data to PCs for offline programming and remote service monitoring.
- Process temperature up to 650°C
- Excellent temperature uniformity
- Heating ramp up to 40 K/min
- Cooling rate up to 180 K/min
- Vacuum level up to 10-1 mbar
- Very high throughput
- Large process area
- VLO 180: 0.66 m2 (1 in.2)
- VLO 300: 1.1 m2 (1.7 in.2)
- Advanced Packaging
- Power Semiconductors