Vacuum Soldering System for small volume production and R&D
The centrotherm c.VLO 20 vacuum soldering system meets the highest demands of R&D departments as well as the needs of small production facilities which use vacuum to achieve voidless soldering joints.
With c.VLO 20, the soldered area affected by voids can be reduced to less than 2% while typical reflow soldering systems range at 20%.
This system is ideal for production facilities which run fluxless and voidless soldering processes with various gas atmospheres (N2, H2 100, N2/H2 95/5). The centrotherm c.VLO 20 optionally provides wet chemical activation with HCOOH or dry chemical activation with MW plasma for ultra clean soldering joints. Even lead free paste or pre-forms can be used without additional flux.
The process control computer comes with a user-friendly touch screen for operating, process profile editing and recipe storing. A serial interface allows to transfer data to PCs for offline programming and remote service monitoring.
- Process temperature up to 450°C
- Excellent temperature uniformity
- Heating ramp up to 50 K/min
- Cooling rate up to 180 K/min
- Vacuum level up to 10-5 mbar
- Very short cycle time
- Advanced Packaging
- Power Semiconductors