c.VLO 6 | c.VLO 12
Vacuum Soldering Systems for Advanced Packaging and R&D
centrotherm c.VLO 6 and c.VLO 12 vacuum soldering systems have been designed for Advanced Packaging and Power Semiconductor applications and achieve very high heating and cooling rates. The systems meet the highest demands of start-ups and R&D departments which use vacuum to achieve voidless soldering joints.
c.VLO 6 and c.VLO 12 is the small-size entry level system of the centrotherm c.VLO family with a 6 liter or 12 liter chamber volume, yet offering the full functionality like the other VLOs. With c.VLO 6 and c.VLO 12, the soldered area affected by voids can be reduced to less than 2% while typical reflow soldering systems range at 20%.
This system is ideally suited for production facilities and start-ups which run fluxless and voidless soldering processes with various gas atmospheres (N2, H2 100, N2/H2 95/5). centrotherm c.VLO 6 and c.VLO 12 optionally provide wet chemical activation with HCOOH or dry chemical activation with in-situ MW plasma for ultra clean soldering joints. Even lead free paste or pre-forms can be used without additional flux.
The process control computer comes with a user-friendly touch screen for operating, process profile editing and recipe storing. A serial interface allows to transfer data to PCs for offline programming and remote service monitoring.
- Process temperature up to 450°C
- Excellent temperature uniformity
- Heating ramp up to 250 K/min
- Cooling rate up to 180 K/min
- Vacuum level up to 10-5 mbar
- Very short cycle time (< 5 minutes)
- Advanced Packaging
- Power Semiconductors